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Materials, consumables, and automated fabrication systems.

Materials

Photoresists & chemicals

Pre-mixed formulations. Non-toxic, water-based, shelf-stable.

Available Now

KOSL RiboResist

Water-based photoresist — PVA + Riboflavin

Non-toxic, shelf-stable photoresist. Spin coat onto substrate, expose at 405–455nm, develop in distilled water. PVA matrix with riboflavin (vitamin B2) photosensitizer.

  • 60mL bottle — enough for 200+ glass slides
  • Exposure wavelength: 405–455nm (blue/violet)
  • Developer: distilled water
  • Shelf life: 6+ months (store dark, room temp)
  • Non-toxic — no organic solvents
$29 CAD
Order Now →
Coming Soon

KOSL ChloroResist

Chlorophyll-based photoresist variant

Alternative formulation using chlorophyll as the photosensitizer, absorbing at 430nm. Same water-based development process. Pending Phase 1 validation.

  • Exposure wavelength: 430nm
  • Chlorophyll photosensitizer
  • Water-based development
  • Pending validation
TBD
Notify Me
Coming Soon

KOSL AlbuResist

Egg white albumen photoresist

Pre-mixed ovalbumin + riboflavin photoresist based on Lev Kropp's albumen lithography research. Dual-function: works as both photoresist and gate dielectric (k ≈ 5–6).

  • Exposure wavelength: 450nm
  • Riboflavin (B2) photosensitizer
  • Developer: distilled water
  • Gate dielectric: k ≈ 5–6
  • Pending Phase 1 validation
TBD
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Systems

Fab machines

Desktop semiconductor fabrication systems with automated process control.

Coming 2026

KOSL 50MT500 Auto

Entry-level automated desktop fab

CNC 3018-based platform with DLP maskless lithography. Semi-automated spin coating and development. 50μm feature resolution, up to ~500 transistors per die.

  • 50μm minimum feature size
  • ~500 transistors max per die
  • CNC 3018 platform + DLP projector
  • Semi-automated spin coat + develop
  • ZnO TFT and Cu2O p-type process
$4,999 CAD
Pre-order →
Coming 2027

KOSL 10MT5000 Auto

Turnkey desktop semiconductor fab

Fully automated fabrication system. Maskless DLP lithography, automated spin coating, development, and wafer handling. HEPA-enclosed cleanroom environment with machine vision alignment. 10–25μm features, up to ~5,000 transistors.

  • 10–25μm minimum feature size
  • ~5,000 transistors max per die
  • Maskless DLP lithography + machine vision
  • Fully automated: spin coat, expose, develop, etch
  • HEPA-enclosed cleanroom environment
  • ZnO TFT on glass or Si MOSFET process
Complete Assembled, tested, calibrated
$8,999 CAD
Kit You assemble — ~4 hours
$3,999 CAD
Plans Open source — build from scratch
Free
DIY

Start from scratch

The complete Albu Phase 1 setup uses $525 in off-the-shelf components.

$200
CNC 3018 Pro
Laser engraver platform
$50
5W 450nm laser
Blue laser diode module
$250
USB Microscope
For pattern verification
$25
Consumables
Egg whites, vitamin B2, glass slides
Build Guide on GitHub